FIPG PLOTTING /FIPG SEALS
effective sealing technique
Form-In-Place Gasket (FIPG) Plotting is an effective sealing technique to achieve high level of sealing between mating parts that is ideal for modern densely populated electronics packaging.
Simply put, form-in-place gaskets are meant to reduce “noise” between cavities on a printed circuit board (PCB) or in an electronics enclosure.
In addition, form-in-place gaskets provide excellent electrical contact to mating conductive surfaces, including printed circuit board traces for cavity-to-cavity isolation.
Our FIPG plotting lines are fully automated with 3-axis robotic dispensing by using customized programming.
We are able to plot UV cured and Oven cured gasket materials from major sealant brands.